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DLPT05
SURFACE MOUNT DATALINE PROTECTION DEVICE
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Features
Mechanical Data
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300 Watts Peak Pulse Power (tp = 8x20 μ s)
Transient Protection for data line to IEC61000-4-2 level 4
(ESD), 8kV HBM
Contact: Discharge – ± 30kV
Air: Discharge – ± 30kV
IEC 61000-4-4 (EFT)
Low Leakage Current
Surface Mount Package Ideally Suited for Automated Insertion
Lead, Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 4 and 5)
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Case: SOT-23
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Marking Information: See Page 2
Ordering Information: See Page 2
Weight: 0.008 grams (approximate)
GROUND
TVS
LINE TO
V CC
Top View
BE PROTECTED
Device Schematic
Maximum Ratings
@T A = 25°C unless otherwise specified
Characteristic
Peak Pulse Power (tp = 8x20 μ s)
Peak Forward Voltage (I PP = 1A, tp = 8x20 μ s)
Diode Peak Repetitive Reverse Voltage
Symbol
P PK
V FP
V RRM
Value
300
2.1
75
Unit
W
V
V
Thermal Characteristics
Characteristic
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
Symbol
R θ JA
T J , T STG
Value
417
-55 to +150
Unit
° C/W
° C
Electrical Characteristics
@T A = 25°C unless otherwise specified
Reverse
Standoff
Voltage
Breakdown Voltage
V BR @ I T
Test
Current
Max. Reverse
Leakage @ V RWM
Max. Clamping
Voltage @ I pp = 1A
(Note 3)
Max. Peak Pulse
Current (Note 2)
Typical Total
Capacitance
V RWM (V)
5
Min (V)
6.0
Max (V)
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I T (mA)
1.0
I R ( μ A)
20
V C (V)
9.8
(A)
17
(pF)
1.9
Notes:
1.
2.
3.
4.
5.
V R = 0V, f = 1MHz from line to be protected to ground pin.
tp = 8x20 μ s.
Clamping voltage value is based on an 8x20 μ s peak pulse current (I pp ) waveform.
No purposefully added lead. Halogen and Antimony Free.
Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured
prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb 2 O 3 Fire Retardants.
DLPT05
Document number: DS30310 Rev. 9 - 2
1 of 4
www.diodes.com
July 2008
? Diodes Incorporated
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